Intel, Odisha government to set up $3.3 billion semiconductor materials facility in India
Intel, 3D Glass Solutions and the Government of Odisha sign MoU for a 3.3 billion dollar substrate manufacturing facility in India, creating about 1,800 skilled jobs.
Intel, 3D Glass Solutions (3DGS) and the Government of Odisha have signed a memorandum of understanding (MoU) to establish a substrate manufacturing technology facility in India with an estimated investment of $3.3 billion.
The proposed project, to be implemented in phases over the next five to six years, is expected to generate around 1,800 highly skilled jobs. The facility will focus on substrate manufacturing, a critical material and process technology used for mounting semiconductor chips on motherboards.
Union Minister Ashwini Vaishnaw welcomed the announcement in a post on X, congratulating the Odisha government, Intel and 3DGS on signing the agreement. “This will further advance semiconductor ecosystem in India,” Vaishnaw said.
The development marks a significant step in India’s efforts to strengthen its semiconductor ecosystem and expand domestic chip manufacturing capabilities.
The proposed project, to be implemented in phases over the next five to six years, is expected to generate around 1,800 highly skilled jobs. The facility will focus on substrate manufacturing, a critical material and process technology used for mounting semiconductor chips on motherboards.
Union Minister Ashwini Vaishnaw welcomed the announcement in a post on X, congratulating the Odisha government, Intel and 3DGS on signing the agreement. “This will further advance semiconductor ecosystem in India,” Vaishnaw said.
Congratulations to the Govt. of Odisha, Intel and 3DGS on signing an MoU to bring substrate manufacturing technology to India.
This will further advance semiconductor ecosystem in India. pic.twitter.com/elxs6r8muN
— Ashwini Vaishnaw (@AshwiniVaishnaw) May 29, 2026
The development marks a significant step in India’s efforts to strengthen its semiconductor ecosystem and expand domestic chip manufacturing capabilities.
(Edited by : Prashant)
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